Electronic potting silica gel-HY-9325

$42.00

Electronic potting silica gel is mainly used for packaging, sealing, filling, and anti-pressure of electronic components. It has excellent adhesion, sealing and thermal stability to PC (electronic insulating sheet), PMMA (plexiglass, acrylic), PCB, and CPU. LED electronic potting silica gel is divided into addition type electronic potting silica gel and condensation type electronic potting silica gel.

SKU: PSD001-HYF663-1-1-1-1-1-1-1-1 分类:

描述

Introduction of electronic potting silica gel:

Electronic potting silica gel is also called potting glue, potting silica gel, electronic glue, encapsulating silica gel, etc. It is a potting material with waterproof, moisture-proof, thermal conductivity, flame retardant, and insulation. After adding the curing agent, the liquid colloid can be cured and formed to protect the electronic components.

Application of electronic potting silica gel:

Mainly used for packaging, sealing, filling and anti-pressure of electronic components. It has excellent adhesion, sealing and thermal stability to PC (electronic insulation sheet), PMMA (plexiglass, acrylic), PCB, and CPU. Hongye LED electronic potting silica gel is divided into addition type electronic potting silica gel and condensation type electronic potting silica gel.

The performance characteristics of electronic potting silica gel:

1. Excellent anti-corrosion, waterproof and moisture-proof, dust-proof, confidentiality, temperature resistance, insulation, heat conduction and heat dissipation, shockproof and other functions.
2. Ozone resistance and chemical resistance;
3. Excellent heat resistance and cold resistance, continuous operation from -60℃ to 220℃, can absorb the stress caused by high temperature cycle inside the package, and protect the chip and its welding gold wire.
4. Low volatile matter, high strength, good adhesion, excellent adhesion to aluminum, copper, stainless steel and other metals;

 

The use process of electronic potting silica gel:

1. Before mixing, first fully stir the A component to make the sedimentation filler fully mix, and the B component to shake well.

2. When mixing, the weight ratio of AB components should be observed.

3. When electronic potting glue is used, it can be defoamed as needed. The A and B mixed glue can be fully stirred and put into a vacuum container, degassed at 0.01MPa for 3 minutes, and then can be poured for use.

4. Electronic potting silica gel is an addition molding curing product. After it is poured, it is cured at room temperature or heated to cure. After it is basically cured, it enters the next process. It takes 24 hours to fully cure. Ambient temperature and humidity have a great influence on curing.

 

Matters needing attention when using electronic potting silica gel:

1. The rubber material should be sealed and stored. The mixed rubber should be used up at one time to avoid waste.

2. This product is a non-dangerous product, but do not take it in the mouth or eyes. If you accidentally enter the mouth and eyes, you should wash it with clean water or go to the hospital for treatment.

3. After a period of storage, the colloid may delaminate. Please stir well before use, it will not affect the performance

 

Electronic potting silica gel-HY-9325

其他信息

Type

HY-9305

Hardness(Aº)

25±3

Mixing weight ratio of two components(A:B)

1:1

Viscosity(cps)

500±100

Operating time(min)

30-60

Curing time(h,25℃)

4-5

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